Capability

Contact Us
Shenzhen Headquarters：
Contact: Mr.Wu 13927418006 Miss Zhong 13510943382
Tel：0755-29961800  
E-mail：szkdpcb@163.com
505, Creative Technology Building, Xinghua Road, Fuyong, Fuyong, Bao'an District, Shenzhen, China
Capability
Process Process Internal capacity Routine regulation Graphical representation
Cutting and splicing Cutting and finished plate thickness Layer number 2～6 Layer（Laminated board）
2～10 Layer（Hard and soft joint plate）
1～8 Layer（Soft plate）
Opening panel size 250*(220～400)mm 
500*(220～400)mm
Finished plate size (maximum) 480mm*380mm
Finished plate size (minimum) 5mm*8mm
Maximum sheet thickness (copper on both sides) 0.3mm
Minimum sheet thickness (copper on one side) 0.05mm(Finished product)
Other auxiliary materials Pressure sensitive adhesive material specification Pressure-sensitive adhesive：
30/50/100/130um
Specification of thermosetting adhesive material Thermosetting adhesive：                   12.5/15/25/40/50um
PI reinforcement (excluding glue) material specification PI：1.0 - 13mil
Specification of pet reinforcement (excluding glue) material White：0.05-0.25mm
Transparent：0.025-0.25mm
FR-4 reinforcement (excluding glue) material specification FR-4：≥50um
Type of other reinforcement materials Stainless steel, aluminum plate, nickel steel sheet according to customer requirements
Common plates Material type Single and double-sided adhesive
Single and double-sided adhesive free and halogen-free
Single and double-sided adhesive without halogen
Base copper thickness (electrolytic or calendered) 1/3oz  1/2oz  1oz  2oz
Substrate PI 0.5mil,0.7mil,0.8mil, 1mil,2mil


Working procedure Item Internal capacity Routine regulation Graphical representation
Working edge size Double sided tin deposition, gold deposition, OSP, tinplate TD direction 10 / 6mm, MD direction 6mm (plywood fixed at TD side, 10 mm)
Single and double-sided electro gold plate (250mm direction) 7mm
Single side tin, gold, OSP board Long side / short side ≥ 6mm
TFT products with fine fingers facing outward Long side / short side ≥ 7mm, and TD side clamp ≥ 10 mm
Multilayer hard and soft combination board Long side / short side ≥ 12mm
Drill hole Drilling tolerance Location tolerance Primary drilling: ± 0.05mm
Secondary drilling: ± 0.1mm
Laser drilling (minimum blind hole) Ø0.08mm
Laser drilling (minimum through hole) Ø0.05mm
Mechanical drilling hole diameter (minimum) Ø0.1mm
Mechanical drilling hole diameter (maximum bit) Ø6.30mm
Slotted hole (minimum) Ø0.60mm
Finished hole diameter tolerance (plated through hole) ±2mil(±0.05mm)
Finished hole diameter tolerance (non plated through hole) ±1mil(±0.025mm)
Hole metallization Black hole, PTH / plating PTH hole minimum hole wall average copper thickness Double sided board：10--18um
Module board(TFT)：8--15um
Hard and soft joint plate：≥20um
Soft board multilayer board：≥16um
If the customer has special requirements, control according to the customer's requirements
Producible size 250 Or 500*（220～400）mm
Graphic circuit Minimum line width / clearance of film Minimum hole ring (calculation of inner layer of multilayer plate) Limit 0.075mm (single and double sided board)
Routine  0.1mm
Safety value 0.12mm
Single side 0.15mm (3 and 4 layers), safety value 0.2mm
Single side 0.25mm (5 and 6-layer plates), safety value 0.3mm
Single side 0.35mm (more than 6 layers)
Minimum hole ring (outer layer of multilayer plate) Single side 0.1mm, safety value 0.15mm


Process Item Internal capacity Routine regulation Graphical representation
Graphic circuit Minimum line width / clearance of film Npth hole to line distance minimum 0.1mm，Safety value 0.2mm (drilling)
0.15mm，Safety value 0.25mm (steel die punching)
Minimum line width / clearance of 1 / 3 oz bottom copper 0.05/0.04mm(Line compensated)
Minimum line width / clearance of 1 / 2 oz bottom copper 0.06/0.07mm(Line compensated)
Minimum line width / clearance of 1oz bottom copper Single panel：0.07/0.08mm(Line compensated)
Double sided board：0.08/0.09mm(Line compensated)
Minimum line width and line distance of outer layer of hard and soft binding plate  0.11/0.09mm(Line compensated)
Minimum line width / clearance of multilayer soft board 0.09/0.07mm(Line compensated)
Etching compensation (overall): 1 oz copper 0.03-0.04mm
Etching compensation (overall): 1 / 2 oz copper 0.02-0.03mm
Etching compensation (overall): 1 / 3 oz copper 0.015-0.02mm
Note: all independent lines shall be increased by 0.01-0.02MM (overall) on the basis of overall compensation; the minimum distance between lines shall be 0.04mm.
Dry film Counterpart tolerance ±0.05mm
Deviation of figures on both sides (degree of coincidence) ±0.05mm
Minimum grid (area) 0.2 × 0.2mm (45 ° angle is the best)
Minimum grid line width / line spacing 0.15/0.15mm
Solder resist Solder resist Minimum single side of opening distance from pad 0.05mm，Safety value 0.075mm
Minimum width of green oil Bridge 0.1mm
One side of green oil bridge cover line is large 0.05mm, safety value 0.075mm
Green minimum window Ø0.025mm，Safety value Ø 0.04mm
Ink thickness ≥ 10um (9-25um in general)，
Crown product thermosetting oil: 9 -- 15um）
Minimum negative word height / minimum line width of green oil 1.0/0.15mm
Character Character Positive text minimum line width 0.1mm，Safety value 0.13MM
Negative text minimum line width 0.125mm，Safety value 0.15mm
Minimum height of text 0.8mm
Minimum width of text 0.8mm


Process Item Internal capacity Routine regulation Graphical representation
Character Minimum distance from character to pad 0.15mm，Safety value 0.25mm
Minimum line width of character segment (non text) 0.1mm，Best value 0.2mm
Minimum distance between character block and one side of pad ≥0.2mm
Minimum distance from character to profile 0.25mm
Carbon oil Minimum carbon oil width / carbon oil spacing 0.25/0.3mm
Minimum distance from profile edge 0.3mm
Carbon oil resistance tolerance (3000 Ω high resistance) ±400Ω
ACP
Conductive adhesive 		ACP thickness range 15-25um
Number of conductive particles ＞30个/mm²
Punching Punching Drilling accuracy tolerance ±1mil（0.025mm）
Fit Coating film processing Minimum drilling of covered membrane window Ø 0.4mm (drilling processing)，
Safety value 0.7mm
Minimum square window with covering film 0.6×0.6mm(Steel mold processing)
0.5×0.5mm(Finishing die processing)
Minimum opening space of covering film 0.5mm(Precision die)、0.2mm（Laser engraving）
0.15mm(Ordinary drilling)
0.2mm（Slotted hole, cross cov drilling Bridge）
Minimum hole diameter of cutting cover film 0.7mm
Cutting the minimum hole diameter of thermosetting adhesive and double-sided adhesive 1.0mm
Minimum opening space of cover film cut by cutter 0.15mm
Minimum opening of cover film for cutting machine 0.6*0.6mm
Minimum punching of covering film 0.6mm(Steel mold processing)
Double sided tape window is larger than FPC single side 0.3-0.5mm
Distance from the edge of the cover film window to the edge of the pad or line Products below 250 × 230mm: 0.05mm (safety value: 0.1mm) ＜ products above 250 × 230mm: 0.075mm (safety value: 0.15mm)
Alignment tolerance of covering film and auxiliary materials ± 0.15mm, safety value ± 0.2mm
Overflow of covering film (single side) Regular 0.08-0.12mm
Limit 0.03mm (TPX pressing)
Electromagnetic membrane SF-PC5000/5500/5900 Black electromagnetic film minus release film thickness 22um/22um/9um


Process Item Internal capacity Routine regulation Graphical representation
Fit Electromagnetic membrane Sf-pc1000 silver electromagnetic film minus release film thickness 32.1um
Tss200 / tss100 black electromagnetic film 22um/12um
Electroplate Surface treatment Nickel plating thickness (plating) 2.54-9um(Normal value 2-6um)    
Thickness of gold plating (plating) 0.025-0.2um
(Normal value 0.025-0.075um)    
Nickel thickness 1-6um (conventional 1-3um or 2-5um)
Thickness of gold deposit 0.025-0.125um
(routine value 0.025-0.075um) 
Tin plating thickness 3-10um
Thickness of tin deposit 0.6-1.2um
OSP Thickness 0.3-0.5um
If the customer has special requirements, control according to the customer's requirements
Punching shear Profile punching Outline Tolerance ± 0.05mm (high precision die)
± 0.07mm (precision mold, etching knife mold)
± 0.1mm (ordinary steel mold, simple steel mold)
± 0.2mm (common cutter die)
Tolerance of external angle dimension (finger center to edge) ± 0.05mm (high precision die)± 0.07mm (precision die making)± 
± 0.1mm (ordinary steel mold making, etching knife mold)  
Transition fillet allowed for sharp corner of profile R≥0.20mm
The minimum distance from the center of the positioning hole to the profile edge 2mm
Minimum distance between units ≥ 0.5mm (suitable for jumping, generally 1-2mm)
Distance between profile edge and shear line ≥ 2.0mm (cutter die), ≥ 2.5mm (manual)
Center distance of positioning hole (Ø 2.0mm) from shear line ≥ 2.5mm (cutter die), ≥ 3mm (manual)
Minimum diameter of semicircle hole 0.25mm, safety value 0.3mm
Minimum distance from line to board edge 0.40mm (hand cut)
0.3mm (common cutter die)
0.15mm (steel mold, etching knife mold)
0.1mm (precision die)


Process Item Internal capacity Internal capacity Graphical representation
Punching shear Profile punching The minimum distance between the line and the board edge is 500mm, and the product is arranged without gaps. 0.3mm（Cutter die）
V-cut
Milling plate V-CUT 		Hard and soft joint plate Diameter of Gong knife Min. δ 0.8mm (min. inner arc radius r0.4mm)
Tube hole NPTH孔 Ø1.0mm
Tolerance Milling plate peripheral tolerance±0.13mm
Minimum distance from line to board edge 0.2mm（Edge of Gong）
FR4 with the thinnest total thickness of V-CUT 0.3mm
Shallowest depth of V-CUT 0.08mm（Bevel angle:45°）
Test Flying needle test Minimum line width / distance of flying pin test 0.05/0.05mm
Maximum height drop of test point 1.5mm
Finished product thickness Finished product thickness Thickness tolerance of finished product (0.05-0.10 mm) ±0.015mm
Thickness tolerance of finished product(0.11-0.2mm) ±0.02mm
Thickness tolerance of finished product(0.21-0.40mm) ±0.03mm
Multilayer hard and soft combination board Determined according to specific plate arrangement structure
Impedance Impedance tolerance Single point impedance tolerance ﹢/-10%
Differential impedance tolerance ﹢/-10%
Board type Double sided board（100+/-10欧） 1MIL 1/3OZ Non adhesive material
1.5MIL 1/3OZ Non adhesive material
1/2MIL 1/3OZ Gum material
Multilayer board Match according to actual materials
SMT SMT Antistatic grade Class A
Dustless grade Level 100 thousand
Minimum components Routine 0201, limit 01005
Minimum component spacing Routine 0.3mm, limit 0.2mm
Min IC pitch 0.3mm
Min connector pitch 0.3mm
Min BGA pitch 0.3mm
Maximum mosaic size Conventional 250 * 240mm limit 330 * 240mm
Maximum board step Normal ≤ 0.3mm limit ≤ 0.35mm
Type of solder paste Lead free halogen free
Solder paste printing thickness 120-180um


Process Item Internal capacity Routine regulation Graphical representation
SMT SMT Minimum tin area 0.3*0.25mm
Solder height Element height more than 1 / 4
Tin height on element pin Greater than 1 / 2 of element pin
IMC alloy layer thickness 1-3um
Number of temperature zone of hot air reflow welding 10 temperature zone
Reflow temperature Maximum 250 degrees centigrade
Manual welding temperature 280-320℃
Deviation tolerance of SMD ±50um
Connector alignment tolerance ±50um
IC alignment tolerance ±50um
Led alignment tolerance ±50um
Led offset angle 1°
Led parallelism tolerance ±50um
AOI inspection capability General: chip minimum: 0201，
IC spacing: pitch=0.3mm；
Limit: chip Min: 01005,
IC spacing: pitch=0.3mm
ICT test 1200 points
Glue UV adhesive, thermosetting adhesive, underfill (bottom filling)
Dispensing overflow tolerance (dispensing side) ±50um
Dispensing overflow tolerance (non dispensing side) ±50um


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Contact Us Shenzhen Headquarters：
Contact: Mr. Wu 13927418006 Miss Zhong 13510943382
Tel：0755-29961800  
E-mail：szkdpcb@163.com
Add：505, Creative Technology Building, Xinghua Road, Fuyong, Fuyong, Bao'an District, Shenzhen, China
Copyright © 2019 Shenzhen Kedashun Circuit Co., Ltd. All Rights Reserved    京ICP证000000号

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